Besi's third-quarter orders nearly double, beating forecasts on AI chip-packaging demand

BE Semiconductor Industries booked €342.6 million in third-quarter orders, up 96% from a year earlier and 17% from the second quarter, ahead of the €298 million analysts expected. The Dutch chip-packaging equipment maker said hybrid-bonding orders so far this year are more than double all of 2025, and CEO Richard Blickman said ASML is not a competitor in die-to-wafer hybrid bonding. Besi expects fourth-quarter revenue within 5% of the third quarter's €283.4 million and announced a new €100 million share buyback.