Nvidia lines up six suppliers to expand substrate, packaging, testing and optics capacity, including a $1.1 billion US testing advance
Announced at GTC Berlin, Nvidia's agreements with IBIDEN, Samsung Electro-Mechanics and Unimicron aim to lift its substrate capacity 2.5x over three years, while Amkor plans to grow its advanced-packaging capacity in South Korea by more than 300% by the end of 2028. Nvidia is giving KYEC a $1.1 billion capacity reservation advance for new US testing facilities targeting high-volume production in April 2027, and SPIL aims to grow co-packaged optics engine capacity 15x by mid-2027. "Demand is extraordinary. Capacity is the constraint," CEO Jensen Huang said.
Source: NVIDIA Newsroom