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Intel and Broadcom CEOs warn capital crunch could become AI's biggest bottleneck

Broadcom CEO Hock Tan and Intel CEO Lip-Bu Tan said at a Singapore conference Monday that financing and the cost of capital may constrain the AI build-out more than shortages of chips, memory, or power. Tan said compute demand could outstrip supply through 2029 or 2030, while both executives stressed that longer-term growth hinges on proving returns from AI investments.

Source: CNBC

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