Intel and Broadcom CEOs warn capital crunch could become AI's biggest bottleneck
Broadcom CEO Hock Tan and Intel CEO Lip-Bu Tan said at a Singapore conference Monday that financing and the cost of capital may constrain the AI build-out more than shortages of chips, memory, or power. Tan said compute demand could outstrip supply through 2029 or 2030, while both executives stressed that longer-term growth hinges on proving returns from AI investments.
Source: CNBC
